Semiconductor Systems
ZYGO's semiconductor metrology systems enable manufacturers to improve the quality and yield of their processes, while lowering metrology costs.
Metrology, Process Control and
Manufacturing Inspection Equipment
Nano™ CSP2000 - High-throughput tool for dedicated inspection of C4 bumps and chip capacitor pads (CCPs) on CSP strips.
Nano2™ Series - Powered by FMI2™ technology, provides unparalleled throughput and accuracy measuring volume, height, diameter, warpage, and coplanarity in quality control for flip-chip substrates and CSP strips, as well as in high-end panel manufacturing.
CP7300™ - Measures 3D surface height, roughness, and local area planarity and uniformity measurements on wafers for rapid, quantitative characterization of photo-lithographic, etch, and polishing process effects. Fast, noncontact, and automated.
Fully Automated Wafer Metrology
As of June 2009, the Z3D and UniFire products are being manufactured and sold by Nanometrics Incorporated. Please read the news release for additional information.
Z3D-7200™ - Measures bare wafer surface roughness, form, and topography, in high resolution, all with just one tool! It handles unpatterned bare wafers, epitaxial, silicon-on-insulator, and customized substrates with equal ease.
Z3D-7000™ - Ensures FEOL process control for critical transistor formation by making fast, non-contact, 3D measurements of etch depth, and surface topography.
UniFire 7900™ - Provides high-precision lithography metrology for high-volume semiconductor IC manufacturers. This fully automated tool delivers critical dimension (CD), overlay, and film thickness in one measurement.
Advanced Film Capability - The Advanced Film Capability (AFC) technology module enables measurement of multilayer films and topography of complex film stacks. AFC can be added to the Z3D-7000, Z3D-7200, and UniFire 7900 high-volume manufacturing products.
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